Infineon XENSIV™ MEMS Sensors: Partner with Bosch for Next-Gen EV Safety
Infineon’s XENSIV™ MEMS pressure sensors are designed to meet the rigorous demands of automotive safety-critical applications. The AEC-Q103 qualified sensors offer ultra-high measurement accuracy (±0.5% full-scale error), a wide operating temperature range of -40℃ to 125℃, and ultra-low power consumption (1.8mA typical), making them ideal for EV brake systems, where real-time pressure monitoring is critical for responsive and reliable braking performance. Additionally, the sensors feature robust EMC (Electromagnetic Compatibility) performance and a compact LGA package, enabling seamless integration into Bosch’s space-constrained brake control modules.

“At Infineon, we are committed to empowering the future of mobility with safe, efficient, and reliable semiconductor solutions,” said Thomas Scheibel, Vice President of Infineon Technologies and Head of the Automotive Sensors Product Line. “Our XENSIV™ MEMS pressure sensors combine decades of automotive expertise with cutting-edge MEMS technology, and we are proud to partner with Bosch to bring next-level safety to electric vehicles worldwide. This collaboration underscores our shared vision of making sustainable mobility safer and more accessible.”
Dr. Markus Heyn, Member of the Board of Management of Robert Bosch GmbH, commented: “Bosch has always been at the forefront of automotive safety innovation, and partnering with Infineon allows us to integrate best-in-class sensor technology into our EV brake systems. Infineon’s XENSIV™ MEMS sensors deliver the precision and robustness we need to meet the evolving safety requirements of electric vehicles, ensuring optimal performance even in harsh operating conditions. Together, we are setting new benchmarks for EV safety and reliability.”
Beyond EV brake systems, Infineon’s XENSIV™ MEMS pressure sensors are widely used in automotive applications such as tire pressure monitoring systems (TPMS), engine management, and ADAS (Advanced Driver-Assistance Systems), as well as industrial and consumer electronics. The sensors’ high precision and reliability help reduce energy consumption, extend vehicle range, and enhance overall system durability—key priorities for EV manufacturers and consumers alike.
Infineon’s commitment to automotive safety is further reinforced by its strict quality control processes and compliance with global automotive standards, including ISO 26262 (functional safety) and IATF 16949 (quality management). The collaboration with Bosch builds on Infineon’s strong track record of partnering with leading automotive suppliers to drive innovation in electric mobility.
More articles
-
Infineon XENSIV™ MEMS Sensors: Partner with Bosch for Next-Gen EV Safety
Infineon’s XENSIV™ MEMS pressure sensors power Bosch’s EV brake systems, delivering high precision & reliability for automotive safety.
-
Infineon CoolMOS™8: High-Density Power Solutions for Data Centers
Infineon 600V CoolMOS™8 Superjunction MOSFET boosts Great Wall Power’s PSU efficiency, enabling high power density for data centers & EV charging.
-
Toshiba XCEZ Series: 20 Surge Protection Zener Diodes (SOD-523) for Automotive
Toshiba expands XCEZ Series with 20 SOD-523 zener diodes (AEC-Q101, low R_DYN) for automotive ADAS, BMS & ECU surge protection.
-
Toshiba TB9084FTG: 3-Phase BLDC Gate Driver IC for Automotive Use
Toshiba TB9084FTG (AEC-Q100 Grade 0) is a compact 3-phase BLDC gate driver IC for automotive body systems, electric pumps & generators.
-
Toshiba 600V Silicon MOSFET (DFN8×8): High-Efficiency Power Solutions
Toshiba 600V silicon MOSFET in DFN8×8 package delivers low RDS(ON)/Qgd for high-efficiency SMPS, data centers & PV systems.
